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Equivalent mechanical properties of through silicon via interposers – A unit model approach
Chen, Cheng-fu, Wu, Sheng-TsaiVolume:
55
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.09.005
Date:
January, 2015
File:
PDF, 1.73 MB
english, 2015