[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Packaging designs and flexural stress estimation for thin-film types of OLED devices
Chang-Chun Lee,, Chih-Sheng Wu,, Tzai-Liang Tzeng,, Chia-Hao Tsai,, Shu-Tang Yeh,, Yi-Hao Peng,, Kuang-Jung Chen,Year:
2012
Language:
english
DOI:
10.1109/impact.2012.6420302
File:
PDF, 1.25 MB
english, 2012