Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Liu, Yang, Meerwijk, Joost, Luo, Liangliang, Zhang, Honglin, Sun, Fenglian, Yuan, Cadmus A., Zhang, GuoqiVolume:
25
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-014-2257-8
Date:
November, 2014
File:
PDF, 1.63 MB
english, 2014