[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Wire bonding characterization for small MLP footprint
Lim, Ly, Kua, Hc, Chong, DavidYear:
2006
Language:
english
DOI:
10.1109/eptc.2006.342765
File:
PDF, 893 KB
english, 2006