[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B., Heilmann, J., Kumar, S. G., Hoelck, O., Walter, H., Wittler, O., Engelmann, G., Wolf, M. J., Beer, G., Pressel, K.Year:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575598
File:
PDF, 1.31 MB
english, 2013