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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Electromigration reliability and morphologies of Cu pillar flip-chip solder joints
Yi-Shao Lai,, Ying-Ta Chiu,, Chiu-Wen Lee,, Yu-Hsiu Shao,, Jiunn Chen,Year:
2008
Language:
english
DOI:
10.1109/ectc.2008.4549991
File:
PDF, 3.19 MB
english, 2008