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[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Development fine pitch area array Cu pillar/lead free solder bumps for large 28nm die in large organic flip chip packages
Osenbach, John, Emerich, Sue, Cate, S., Brady, D., Hwang, Seung Min, Dang, J., Crouthamel, D.Year:
2014
Language:
english
DOI:
10.1109/ectc.2014.6897270
File:
PDF, 1.50 MB
english, 2014