[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Advanced flip-chip package solution for 28nm Si node and beyond
Liu, C. S., Chen, C. S., Lee, C. H., Tsai, H. Y., Pu, H. P., Cheng, M. D., Kuo, T. H., Chen, H. W., Wu, C. Y., Lii, M. J., Yu, Doug C. H.Year:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248867
File:
PDF, 1011 KB
english, 2012