[IEEE 2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing - Tokyo, Japan (12-14 Dec. 2005)] 2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing - Life-cycle Assessment of LSI Packaging Embossed Tape Made from Bio-based Polymer
Horikoshi, Y., Hashitani, T., Kutami, M., Yazaki, K., Ando, Y.Year:
2005
Language:
english
DOI:
10.1109/ecodim.2005.1619183
File:
PDF, 1.78 MB
english, 2005