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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Collaborative effect between additives and current in TSV via filling process
Zou, Kaihe, Ling, Huiqin, Li, Qi, Cao, Haiyong, Yu, Xianxian, Li, Ming, Mao, DaliYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270783
File:
PDF, 801 KB
english, 2009