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[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Evaluation of the ultra thin multi die outline (Ulthimo) concept as a package for high frequency transistors
de Samber, M., Weekamp, W., Yuan, P., Caers, J., Poi-Siong Teo,, Rotaru, M.D.Year:
2003
Language:
english
DOI:
10.1109/eptc.2003.1271503
File:
PDF, 336 KB
english, 2003