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[IEEE 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Bangalore, India (2007.07.11-2007.07.13)] 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Influence of Technological Parameters on the Behavior during Aging at High Temperature of Various Packages, in the Automotive Environment
Auguste, Bahi Manoubi, Pascal, Lecuyer, Annabelle, Gentil, Helene, Fremont, Jean-Pierre, Landesman, Frederic, Christien, Rene, Le GallYear:
2007
Language:
english
DOI:
10.1109/ipfa.2007.4378062
File:
PDF, 5.30 MB
english, 2007