[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications
Jinwoo Choi,, Dong Gun Kam,, Daehyun Chung,, Srinivasan, K., Govind, V., Joungho Kim,, Swaminathan, M.Year:
2005
Language:
english
DOI:
10.1109/epep.2005.1563703
File:
PDF, 2.68 MB
english, 2005