[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Analytical description of the out-of-plane equivalent mechanical properties of through-silicon via interposers
Chen, Cheng-fu, Wu, Sheng-Tsai, Dai, Ming-Ji, Chien, Heng-Chieh, Chen, Chang-Sheng, Lo, Wei-ChungYear:
2013
Language:
english
DOI:
10.1109/impact.2013.6706688
File:
PDF, 666 KB
english, 2013