[IEEE 2009 32nd International Spring Seminar on Electronics Technology (ISSE) - Brno, Czech Republic (2009.05.13-2009.05.17)] 2009 32nd International Spring Seminar on Electronics Technology - Stability of gold bonding and Ti/Au ohmic contact metallization to n-SiC in high power devices
Kisiel, Ryszard, Guziewicz, Marek, Piotrowska, Anna, Kaminska, Eliana, Golaszewska, Krystyna, Kwietniewski, Norbert, Paszkowicz, Wojciech, Pagowska, Karolina, Ratajczak, Renata, Stonert, AnnaYear:
2009
Language:
english
DOI:
10.1109/isse.2009.5207044
File:
PDF, 1.67 MB
english, 2009