[IEEE 52nd Electronic Components and Technology Conference...

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface

Goyal, D., Lane, T., Kinzie, P., Panichas, C., Kam Meng Chong,, Villalobos, O.

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Year:

2002

Language:

english

DOI:

10.1109/ectc.2002.1008179

File:

PDF, 1.73 MB

english, 2002

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