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[IEEE 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Shatin, Hong Kong, China (2009.12.2-2009.12.4)] 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces
Chuang, Hao-Hsiang, Chih-Jung Hsu,, Ming-Zhang Hong,, Hsu, Darren, Huang, Raphael, Hsiao, Li Chang, Wu, Tzong-LinYear:
2009
Language:
english
DOI:
10.1109/edaps.2009.5404014
File:
PDF, 860 KB
english, 2009