[American Vacuum Soc 2000 5th International Symposium on Plasma Process-Induced Damage - Santa Clara, CA, USA (22-24 May 2000)] 2000 5th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.00TH8479) - O/sub 2/-plasma degradation of low-K organic dielectric and its effective solution for damascene trenches

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.