[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages
Shirangi, M.H., Wunderle, B., Wittler, O., Walter, H., Michel, B.Year:
2009
Language:
english
DOI:
10.1109/esime.2009.4938412
File:
PDF, 5.99 MB
english, 2009