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[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Mechanical test for vapor phase solder joint
Dumitru, Georgiana, Tudor, Andrei, Cananau, Sorin, Plotog, Ioan, Varzaru, GaudentiuYear:
2012
Language:
english
DOI:
10.1109/siitme.2012.6384401
File:
PDF, 749 KB
english, 2012