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[IEEE 3rd Electronics Packaging Technology Conference - Singapore (5-7 Dec 2000)] Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) - Micro-mechanical characterizations of solder mask materials

Hau Zhu,, Yifan Guo,, Wen-Ying Li,, Tseng, A.A., Martin, B.
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Year:
2000
Language:
english
DOI:
10.1109/eptc.2000.906364
File:
PDF, 483 KB
english, 2000
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