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[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - A cost-effective active cooling method: Thermal performance and cost analysis
Liu, Sheng, Ling Xu,, Mingxiang Chen,Year:
2012
Language:
english
DOI:
10.1109/esime.2012.6191805
File:
PDF, 1.22 MB
english, 2012