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[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Interface microstructure and mechanical fatigue behavior of Sn/sub 63/Pb/sub 37/ on electroplated Cu and Ni
Zhang, C., Jian-Ku Shang,, Pilin Liu,Year:
2000
Language:
english
DOI:
10.1109/ectc.2000.853135
File:
PDF, 435 KB
english, 2000