[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - A Study of Failure Mechanism and Reliability Assessment for the Panel Level Package (PLP) Technology
Yew, Ming-Chih, Wei, Hsiu-Ping, Huang, Ching-Shun, Hu, Dyi-Chung, Yang, Wen-Kung, Chiang, Kou-NingYear:
2007
Language:
english
DOI:
10.1109/esime.2007.360003
File:
PDF, 9.04 MB
english, 2007