[IEEE 2007 International Conference on Thermal, Mechanical...

  • Main
  • [IEEE 2007 International Conference on...

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - A Study of Failure Mechanism and Reliability Assessment for the Panel Level Package (PLP) Technology

Yew, Ming-Chih, Wei, Hsiu-Ping, Huang, Ching-Shun, Hu, Dyi-Chung, Yang, Wen-Kung, Chiang, Kou-Ning
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2007
Language:
english
DOI:
10.1109/esime.2007.360003
File:
PDF, 9.04 MB
english, 2007
Conversion to is in progress
Conversion to is failed