[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Copper wire bond reliability evaluation using a modular test chip
Trigg, A. D., Chai Tai Chong,, Fen, S. Y. P., Kwee, J. L. T., Ming, C. C. H., Mung, S. C. S., Ping, C., Ganesh, V. P., Low, B., Chu, T. L., Leng, E. P.Year:
2012
Language:
english
DOI:
10.1109/eptc.2012.6507072
File:
PDF, 5.62 MB
english, 2012