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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Effects of package and mold cavity structures on the wire sweep behavior during package array transfer molding
Jiale Han,, Haibin Chen,, Fei Wong,, Leung, Karina, Shiu, Ivan, Jingshen Wu,Year:
2011
Language:
english
DOI:
10.1109/eptc.2011.6184502
File:
PDF, 2.05 MB
english, 2011