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[IEEE 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Shangri-La's Rasa Sentosa Resort, Singapore (27 June-1July, 2005)] Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Electromigration-induced copper interconnect degradation and failure: the role of microstructure
Zschech, E., Meyer, M.A., Zienert, I., Langer, E., Geisler, H., Preusse, A., Huebler, P.Year:
2005
Language:
english
DOI:
10.1109/ipfa.2005.1469136
File:
PDF, 356 KB
english, 2005