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[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Robust and low cost copper contact application for low power device at 32 nm-Node and beyond
Isobayashi, Atsunobu, Kelly, James J, Watanabe, Takeshi, Fujiwara, Makoto, Koburger, Charles, Maniscalco, Joseph, Vo, Tuan, Chiang, Sunny K, Ren, James, Spooner, Terry, Takayanagi, Mariko, Usui, TakamYear:
2009
Language:
english
DOI:
10.1109/iitc.2009.5090325
File:
PDF, 878 KB
english, 2009