[IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San Jose, CA, USA (2012.06.4-2012.06.6)] 2012 IEEE International Interconnect Technology Conference - Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's
Wilson, C. J., De Wolf, I., Vandevelde, B., De Messemaeker, J., Ablett, J. M., Redolfi, A., Simons, V., Beyne, E., Croes, K.Year:
2012
Language:
english
DOI:
10.1109/iitc.2012.6251639
File:
PDF, 520 KB
english, 2012