High-G drop impact response and failure analysis of a chip...

International Journal of Impact Engineering 2007 Vol. 34; Iss. 10

High-G drop impact response and failure analysis of a chip packaged printed circuit board

S.T. Jenq, H.S. Sheu, Chang-Lin Yeh, Yi-Shao Lai, Jenq-Dah Wu
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Volume:
34
Year:
2007
Language:
english
Pages:
13
DOI:
10.1016/j.ijimpeng.2006.07.004
File:
PDF, 2.23 MB
english, 2007
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