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Fine grinding of silicon wafers: effects of chuck shape on grinding marks
Wangping Sun, Z.J. Pei, G.R. FisherVolume:
45
Year:
2005
Language:
english
Pages:
14
DOI:
10.1016/j.ijmachtools.2004.09.020
File:
PDF, 1.26 MB
english, 2005