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Effects of diamond size of CMP conditioner on wafer removal rates and defects for solid (non-porous) CMP pad with micro-holes
Ji Chul Yang, Joo Hoon Choi, Taewook Hwang, Chil-Gee Lee, Taesung KimVolume:
50
Year:
2010
Language:
english
Pages:
9
DOI:
10.1016/j.ijmachtools.2010.06.007
File:
PDF, 1.92 MB
english, 2010