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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - An innovative and low cost Bi-layer method for temporary bonding
Burggraf, Jurgen, Wiesbauer, Harald, Bravin, Julian, Uhrmann, Thomas, Meynen, Herman, Civale, Yann, John, Ranjith, Wang, Sheng, Fu, Peng-Fei, Yeakle, CraigYear:
2013
DOI:
10.1109/eptc.2013.6745685
File:
PDF, 336 KB
2013