Failure Analysis of Superjunction VDMOS Under UIS Condition

IEEE Transactions on Device and Materials Reliability 2014 / 3 Vol. 14; Iss. 1

Failure Analysis of Superjunction VDMOS Under UIS Condition

Jing Zhu,, Weifeng Sun,, Yifan Wu,, Shengli Lu,, Yangbo Yi,
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Volume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2013.2267744
Date:
March, 2014
File:
PDF, 1.20 MB
english, 2014
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