Investigation of Sn-Cu intermetallic compounds by AFM: new...

Investigation of Sn-Cu intermetallic compounds by AFM: new aspects of the role of intermetallic compounds in whisker formation

Wan Zhang,, Egli, A., Schwager, F., Brown, N.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
28
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2005.847441
Date:
January, 2005
File:
PDF, 2.39 MB
english, 2005
Conversion to is in progress
Conversion to is failed