Investigation of Sn-Cu intermetallic compounds by AFM: new aspects of the role of intermetallic compounds in whisker formation
Wan Zhang,, Egli, A., Schwager, F., Brown, N.Volume:
28
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/tepm.2005.847441
Date:
January, 2005
File:
PDF, 2.39 MB
english, 2005