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Integrated single and two-phase micro heat sinks under IGBT chips
Gillot, C., Meysenc, L., Schaeffer, C., Bricard, A.Volume:
22
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/6144.796540
Date:
January, 1999
File:
PDF, 233 KB
english, 1999