Simulation of Migration Effects in Solder Bumps

IEEE Transactions on Device and Materials Reliability 2008 / 09 Vol. 8; Iss. 3

Simulation of Migration Effects in Solder Bumps

Weide-Zaage, K.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
8
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2008.2002342
Date:
September, 2008
File:
PDF, 1.73 MB
english, 2008
Conversion to is in progress
Conversion to is failed