![](/img/cover-not-exists.png)
[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Power supply analysis in package and SiP design
Dai, WenliangYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270770
File:
PDF, 1.30 MB
english, 2009