[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Materials options for dielectrics in integrated capacitors
Ulrich, R., Schaper, L.Year:
2000
Language:
english
DOI:
10.1109/isapm.2000.869240
File:
PDF, 562 KB
english, 2000