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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - iNEMI Solder Paste Deposition Project report — Optimizing solder paste printing for large and small components
Chen, Cherie, Feng, Laye, Mohanty, Rita, Mao, Runsheng, Xia, Chuan, Teoh, DesmondYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699674
File:
PDF, 337 KB
english, 2010