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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Vibration Testing and Analysis of Ball Grid Array Package Solder Joints
Wong, Shaw Fong, Malatkar, Pramod, Rick, Canham, Kulkarni, Vijay, Chin, IanYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373825
File:
PDF, 4.97 MB
english, 2007