[IEEE 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Shatin, Hong Kong, China (2009.12.2-2009.12.4)] 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Filter integration in ultra thin organic substrate via 3D stitched capacitor
Min, Sunghwan, Hwang, Seunghyun, Chung, Daehyun, Swaminathan, Madhavan, Sridharan, Vivek, Chan, Hunter, Fuhan Liu,, Sundaram, Venky, Tummala, Rao R.Year:
2009
Language:
english
DOI:
10.1109/edaps.2009.5404004
File:
PDF, 808 KB
english, 2009