![](/img/cover-not-exists.png)
[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Characterization of material properties of low temperature curing polymer dielectrics
Huffman, Alan, Butler, Marianne, Piascik, Jeffrey, Garrou, Philip, Im, JayYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898544
File:
PDF, 977 KB
english, 2011