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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Study of isothermal bending fatigue test
Lou, Minyi, Wen, Long, Chen, Zhengrong, Zhou, Jianwei, Wang, Qian, Lee, JaisungYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270600
File:
PDF, 2.51 MB
english, 2009