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[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Sustainable development of microelectronic technology processes integration of ecodesign
Griese, H., Schischke, K., Reichl, H., Stobbe, L.Year:
2004
Language:
english
DOI:
10.1109/hpd.2004.1346690
File:
PDF, 627 KB
english, 2004