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[IEEE 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Alba Iulia, Romania (2012.10.25-2012.10.28)] 2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Investigation of the oxidation process at the copper-solder interface with atomic force microscopy
Bonyar, Attila, Hurtony, Tamas, David, SzabolcsYear:
2012
Language:
english
DOI:
10.1109/siitme.2012.6384400
File:
PDF, 2.68 MB
english, 2012