[IEEE 7th. Int. Conf. on Thermal, Mechanical and...

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[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Experimental Investigation on the Leakage Reverse Current Component Flowing at the Semiconductor PN Junction Periphery

Obreja, V.V.N., Codreanu, C.
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Year:
2006
Language:
english
DOI:
10.1109/esime.2006.1644014
File:
PDF, 261 KB
english, 2006
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