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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Design and Optimization of Bump Structures of Large Die Fine Pitch Copper/Low-k FCBGA and Copper Post Interconnections
Biswas, Kalyan, Liu, Shiguo, Zhang, Xiaowu, Chai, TCYear:
2008
Language:
english
DOI:
10.1109/eptc.2008.4763472
File:
PDF, 3.45 MB
english, 2008