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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Chip-last Embedded Active for System-On-Package (SOP)
Lee, Baik-Woo, Sundaram, Venky, Wiedenman, Boyd, Yoon, Chong K, Kripesh, Vaidyanathan, Iyer, Mahadevan, Tummala, Rao RYear:
2007
Language:
english
DOI:
10.1109/ectc.2007.373812
File:
PDF, 4.89 MB
english, 2007