[IEEE Advances in Electronic Materials and Packaging 2001 -...

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[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - The effect of roughness and pattern of the core material to adhesion in making build-up layers

Jalonen, P., Tuominen, A.
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Year:
2001
Language:
english
DOI:
10.1109/emap.2001.983964
File:
PDF, 506 KB
english, 2001
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